High Speed Serdes Devices and Applications (inbunden)
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Format
Inbunden (Hardback)
Språk
Engelska
Antal sidor
490
Utgivningsdatum
2008-10-23
Upplaga
2009 ed.
Förlag
Springer-Verlag New York Inc.
Medarbetare
Mohammad, Amanullah (förf)/Rockrohr, James Donald (förf)
Illustratör/Fotograf
185 schw-w Zeichn 20 schw-w Abb, 25 schw-w Fotos 65 schw-w Tabellen
Illustrationer
20 Illustrations, black and white; XIV, 490 p. 20 illus.
Dimensioner
236 x 163 x 30 mm
Vikt
794 g
Antal komponenter
1
Komponenter
1 Hardback
ISBN
9780387798332

High Speed Serdes Devices and Applications

Inbunden,  Engelska, 2008-10-23
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The simplest method of transferring data through the inputs or outputs of a silicon chip is to directly connect each bit of the datapath from one chip to the next chip. Once upon a time this was an acceptable approach. However, one aspect (and perhaps the only aspect) of chip design which has not changed during the career of the authors is Moores Law, which has dictated substantial increases in the number of circuits that can be manufactured on a chip. The pin densities of chip packaging technologies have not increased at the same pace as has silicon density, and this has led to a prevalence of High Speed Serdes (HSS) devices as an inherent part of almost any chip design. HSS devices are the dominant form of input/output for many (if not most) high-integration chips, moving serial data between chips at speeds up to 10 Gbps and beyond. Chip designers with a background in digital logic design tend to view HSS devices as simply complex digital input/output cells. This view ignores the complexity associated with serially moving billions of bits of data per second. At these data rates, the assumptions associated with digital signals break down and analog factors demand consideration. The chip designer who oversimplifies the problem does so at his or her own peril.
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Innehållsförteckning

Serdes Concepts.- HSS Features and Functions.- HSS Architecture and Design.- Protocol Logic and Specifications.- Overview of Protocol Standards.- Reference Clocks.- Test and Diagnostics.- Signal Integrity.- Power Analysis.- Chip Integration.