Mechanics of Solder Alloy Interconnects (inbunden)
Format
Inbunden (Hardback)
Språk
Engelska
Antal sidor
418
Utgivningsdatum
1994-01-01
Upplaga
1994 ed.
Förlag
Van Nostrand Reinhold Inc.,U.S.
Medarbetare
etc.
Illustrationer
XIV, 418 p.
Dimensioner
236 x 161 x 28 mm
Vikt
758 g
Antal komponenter
1
Komponenter
1 Hardback
ISBN
9780442015053

Mechanics of Solder Alloy Interconnects

Inbunden,  Engelska, 1994-01-01
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The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
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Innehållsförteckning

Foreword; Acknowldgement; Introduction: the mechanics of soldere alloy interconnect; Microstructural influences on the mechanical properties of solder; Interfaces and intermetallics; Constitutivemodels; Prediction of solder joint geometry; Life prediction and accelerated testing; Thermomechanical modeling of solder joints - numerical considerations; Applications - through-hole; Surface mount solder joints under thermal, mechanical, and vibration conditions; Index