Assembly and Reliability of Lead-Free Solder Joints (e-bok)
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Format
E-bok
Filformat
EPUB med LCP-kryptering (0.0 MB)
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Nedladdning
Kan laddas ned under 24 månader, dock max 6 gånger.
Språk
Engelska
Utgivningsdatum
2020-05-29
Förlag
Springer Nature Singapore
ISBN
9789811539206

Assembly and Reliability of Lead-Free Solder Joints E-bok

E-bok (LCP),  Engelska, 2020-05-29
1649
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This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
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